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Absolute Maximum Ratings
Values are at T A =25 ° C unless otherwise noted.
Symbol
V+ MAX_OP
V+ 24
V- MAX_OP
Parameter
Steady-State Normal Operating Voltage between POS and CTL Pins
(V IN = V+ MAX_OP , I IN = 1.5A, Switch On)
24-Hour Normal Operating Voltage Withstand Capability between POS
and CTL Pins (V IN = V+ 24 , I IN = 1.5A, Switch On) (1)
Steady-State Reverse Bias Standoff Voltage between POS and CTL Pins
(V IN = V- MAX_OP )
Value
+25
+32
-30
Unit
V
V IN = 5V, Continuous
I IN
Input Current
(2)
(see Figure 4)
8
A
T J
Operating Junction Temperature
150
°C
T A = 25°C
P D
Power Dissipation
T C = 25°C
(2)
(see Figure 4)
36
2.3
W
Steady-State Diode Continuous Forward Current from POS to NEG
I DIODE_CONT
I DIODE_PULSE
(2)
(see Figure 4)
Pulsed Diode Forward Current from POS to NEG (300μs Pulse) (2) (see
Figure 5)
Human Body Model, JESD22-A114
Charged Device Model, JESD22-C101
2
450
8
2
A
ESD
Electrostatic
Discharge
Capability
System Model,
IEC61000-4-2
NEG is shorted to CTL
and connected to GND
No external connection
Contact
Air
Contact
8
15
3
kV
between NEG and CTL
Air
4
Notes:
1. The V +24 rating is NOT a survival guarantee. It is a statistically calculated survivability reference point taken on
qualification devices, where the predicted failure rate is less than 0.01% at the specified voltage for 24 hours. It is
intended to indicate the device’s ability to withstand transient events that exceed the recommended operating
voltage rating. Specification is based on qualification devices tested using accelerated destructive testing at
higher voltages, as well as production pulse testing at the V +24 level. Production device field life results may vary.
Results are also subject to variation based on implementation, environmental considerations, and circuit
dynamics. Systems should never be designed with the intent to normally operate at V +24 levels. Contact Fairchild
Semiconductor for additional information.
2. The device power dissipation and thermal resistance (R θ ) are characterized with device mounted on the following
FR4 printed circuit boards, as shown in Figure 4 and Figure 5
Figure 4. 1 Square Inch of 2-ounce copper
Thermal Characteristics
Figure 5. Minimum Pads of 2-ounce Copper
Symbol
Parameter
Value
Unit
Thermal Resistance, Junction to Ambient
R θ JC
R θ JA
Thermal Resistance, Junction to Case
(2)
(see Figure 4)
3.4
50
°C/W
? 2012 Fairchild Semiconductor Corporation
FR014H5JZ ? Rev. C2
3
www.fairchildsemi.com
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